Industrial
Materials, Semiconductors and Polymers
Subsurface Imaging
of Cracking and Corrosion Under Paints
Applications: Improved structural
analysis of metal surfaces, including aircraft, bridges, piers,
vehicles, and boats
Project Description: Use optical
methods to detect corrosion on a metallic surface or cracks
beneath paint. The following techniques are being investigated:
- Mid-Infrared (MIR) scanning Imaging: using back reflection
geometry we have imaged corrosion and micro-cracks beneath
paint layers of thickness to 80-100mm.
- Near-infrared (NIR) spectral polarization CCD: results
show that corrosion on metals and small cracks underneath
paints can be identified through a thickness of paint greater
than100 mm.
- Femtosecond second harmonic generation (SHG).
Benefits: Quick, environmentally friendly
and inexpensive method to determine need for repairs of large
painted structures without removing paint
Tunable Multiple Quantum Well GaN/AlGaN
UV Photodetectors
Applications: Ultraviolet spectroscopy,
florescence and reflectance based instruments for military,
medical and industrial uses
Project Description: Develop next generation
UV photodetectors with high efficiency and high response speed.
These GaN/AlGaN multiple-quantum-well (MQW) photodetectors
can be used in space-to-earth and space-to-space communication,
missile plume detection, combustion sensing and control for
aircraft engines, optical storage, air quality monitoring,
and personal UV exposure dosimetry.
Benefits: Higher sensitivity (gain) than
currently available devices
Optical and Thermal Conductivity Characterization
of GaN, GaAlN and Other Wide Band Gap Semiconductors
Applications: High-power LEDs and long-lifetime
lasers
Project Description: Develop techniques
and instrumentation for improved detection, characterization
and study of structural defects and materials quality in wide
band gap semiconductors by measuring high spatial/depth resolution
(2-3 mm) thermal conductivity using scanning thermal microscopy
and also by various optical methods such as electro modulation
(photoreflectance and contactless electro-reflectance) and
Raman scattering, including micro-Raman scattering. Determining
local thermal properties near defects will enable minimization
of local thermal buildup and maximization of overall heat
dissipation, which will lead to development of more stable,
longer-lived devices.
Benefits: More stable, longer-lived semiconductor
devices, high-power LEDs and long lifetime lasers. Improve
instrumentation for defect detection.
Colored Photovoltaic Modules Integrated
into Building Materials
Applications: Photovoltaic (PV) modules
integrated into materials used on building exteriors
Project Description: Create aesthetic, energy-efficient
architectural building materials. Current emphasis is on techniques
and materials for adding color to PV panels while maintaining
cell efficiency. Successful tests indicate that panels using
dye-doped polymer films may represent a viable approach.
Benefits: Architecturally viable and efficient
electrical solar power generation
Defect Detection in PCB Interconnects
Applications: Quality control, PCB defect
management
Project Description: Develop an optical
imaging technique and apparatus to nondestructively detect
“hard-to-see” defects on PCB interconnect products
using photon migration.
Benefits: Reduce inspection costs and waste;
increase understanding of PCB failure mechanisms
Cationic Copolymerization
Applications: Consumer products, including
paints and coatings, optical recording, textiles, plastics,
gears for machinery, fuel tanks and plumbing
Project Description: Develop techniques
for synthesis of novel comonomers using cationic copolymerization
to form new high-performance engineering plastics with much
improved and broader technical applications
Benefits: New materials with better properties
for use in plastics, paints, and textiles
Photodeposition of Porous Claddings
on Silica Fibers
Applications: Fiber optic temperature, pressure
and displacement sensors; switches; modulators
Project Description: Characterize the morphology
and porosity of porous silica claddings on micron diameter
optical fibers. Obtain optical micrographic pictures of cladding
morphology and surface roughness as measured by atomic force
microscopy. Determine the porosity of the cladding by doping
with Fe(CO)5 and examine photodeposition in the fiber cladding.
Benefits: Very high-resolution sensors and
high-speed optical switches. Potential low cost manufacturing
technique.
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